Introductie Aktie:
Team Hybrid presenteerd de Ultimate X-Clamp Fix ADVANCED.
Tijdelijk ontvangst u gratis de Xbox 360 Toolkit erbij (1 per klant, per bestelling)
Als extra wordt speciaal voor Dynamodz de ''shims'' en ''thermal compund'' toegevoegd aan de kit.
Dit is de MEEST COMPLETE KIT verkrijgbaar.
Material included in the kit:
- Uniclamp Advanced metal plate
- Hybrid Advanced Foam shims GPU/CPU
- 8x M5 machine screws
- 8x M5 spring washers
- 42x M5 steel washers(+2 reserve)
- 1-timeuse high dissipative ceramic thermal compound
- Tijdelijk een gratis Xbox 360 Toolkit erbij (1 per klant, per bestelling)
The Hybrid Advanced kit is the ultimate way to fix your Xbox 360 console.
It corrects the failed metal case design amongst with the X-Clamps and can be called the first real X-Clamp Replacement, as the X-Clamp is replaced with the Uniclamp the key element of our new fix.
The initial problem is that heat and especially the flexing caused by these flaws stress the solder balls under the GPU and CPU and in the end cause the solder balls to become cold and loose contact.
At first these design flaws are corrected by flattening the case out to prevent the console from failing again.
The actual fix consists mainly out of the Uniclamp Advanced and the Hybrid Advanced Foam Shims, the Uniclamp is placed on the bottom of the case and the foam shims fill out the gap in between the outer parts of the chip.
Then the heatsinks are mounted and the mainboard is fixed to the case with 8 M5 machine screws, when these are tightened the foam pads of the Uniclamp compress and develop a counter force on the chip from below while the foam shims and the chip die are pushed down evenly by the heatsink. Like that the solder balls in between chip and mainboard which have become disconnected are pressed effectively back together and are thereby reconnected which allows the console to function again.
This even counter-pressure is the difference to all other fixes the pressure is shared up on the whole chip, also the outer parts thanks to the shims, not just the center of the die this always led to flexing and the reversed flexing effect of the X-Clamps.
To prevent the mainboard from flexing downwards the pads from the uniclamp keep the mainboard leveled with the counterpressure and also strengthen the sandwich effect which keeps the solder joint reconnected
In addition the mainboard is fixed to the case which gives it more stability.
This fix contains the good parts from all older fixes and new features for newly discovered issues and can thereby consider itself to be the most up-to-date and thereby best fix out in the wild.
Op onze forum vind u meer info, foto's en een uitgebreide handleiding van deze kit.
